Qualcomm has unveiled two new upcoming chipsets on Qualcomm’s new Modular Platform. The Snapdragon 865 is the successor to the 855. The Snapdragon 865 can be paired with the Snapdragon X55 Modem, which succeeds the X50 Modem with a newer, more power efficient process. The X55 will also support both mmWave and Sub-6 GHz 5G networks with improved bandwidth on Sub-6GHz.
The other chip set, the Snapdragon 765/765G is a new chipset with integrated support for 5G.The Snapdragon 765(G) comes with integrated 5G support, but that’s all the information on the modem for now.
The newly announced 3D Sonic Max fingerprint sensor is a follow up of the 3D Sonic sensor from last year. It has a significantly larger workable area and even allows the user to authenticate with two fingers, such as using both thumbs. The accuracy of the scanner has improved a whole lot.